Richard,

Am I correct in assuming that the Ni plating is electroless?

David A. Douthit
Manager
LoCan LLC

Richard Kraszewski wrote:

>I understand that Infineon has adopted this Ni underplating strategy
>extensively for their Pb-Free line.
>
>Rich Kraszewski
>Advanced Manufacturing Engineer - KEDS
>Phone:  260.925.8919
>Pager:  812.481.3492
>
>
>
>
>-----Original Message-----
>From: TechNet [mailto:[log in to unmask]] On Behalf Of Guenter Grossmann
>Sent: Monday, January 26, 2004 11:39 AM
>To: [log in to unmask]
>Subject: Re: [TN] Antw: [TN] Lead-free Component Finishes
>
>
>Jim
>
>I was talking last week with a person from Motorola Germany and a
>someone from Collini. In the discussion both told me that by using a Ni-
>underplate and with the appropriate plating chemistry they don't' see
>problems with whiskers anymore. Earlier, in a conference from
>Electrosuisse, I had a discussion with a speaker talking about whisker
>growth as a function of grain size of the Sn plating which can be
>controlled with the appropriate chemistry and process parameters. What I
>learned in these discussion was that whiskers are a problem that can be
>controlled. In the worst case, in my understanding, it's a question of
>money. Annealing the plating can reduce the internal stress in the
>plating and diminish whisker growth. Wrong?
>
>Best regards
>
>Guenter
>
>
>
>EMPA
>Swiss Federal Laboratories  for Materials Testing and Research Centre
>for Reliability Guenter Grossmann,  Senior Engineer
>
>8600 Duebendorf
>Switzerland
>
>Phone: xx41 1 823 4279
>Fax :     xx41 1 823 4054
>mail:     [log in to unmask]
>
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