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January 2004

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Subject:
Re: MSD Question
From:
Dave Hillman <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 15 Jan 2004 09:53:07 -0600
Content-Type:
text/plain
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text/plain (58 lines) 
Hi Don! Here's a quick answer - if the Sn/Pb component finish is not
sufficiently thick you will run the risk of degrading the solderability -
the higher the bake temperature the quicker/greater the degradation. Good
Luck.

Dave Hillman
Rockwell Collins
[log in to unmask]




                      Donald Vischulis
                      <dvischulis@earth        To:       [log in to unmask]
                      link.net>                cc:
                      Sent by: TechNet         Subject:  [TN] MSD Question
                      <[log in to unmask]>


                      01/14/2004 08:26
                      PM
                      Please respond to
                      Donald Vischulis






Just a quick question:  What is your opinion of a MSD control procedure the
requires baking tin/lead terminated (coated) components every 7 days?

Don Vischulis

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