Ramon
We looked at SIPAD in a former project with great success. No failures
due to paste printing, easy placement of components, we could even place
QFP 0.3 by hand.
There is one problem though (as always): The sticky flux on the surface
gets liquid when hot which means that the bare boards must stay cool.
There once one a case where the truck delivering the boards stood in the
sun over the weekend and the boards where a sticky mess.
Best regards
Guenter
EMPA
Swiss Federal Laboratories for Materials Testing and Research
Centre for Reliability
Guenter Grossmann, Senior Engineer
8600 Duebendorf
Switzerland
Phone: xx41 1 823 4279
Fax : xx41 1 823 4054
mail: [log in to unmask]
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