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December 2003

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Subject:
From:
Denis Caissie <[log in to unmask]>
Reply To:
Date:
Wed, 10 Dec 2003 15:14:25 -0500
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Yes, we can do that size and layer count at Northrop, but we would use
electroplated NiAu in place of the ENIG and PISM in place of dry film.

Denis Caissie
Northrop Grumman Interconnect Technologies
603-424-4273

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Dwight Mattix
Sent: Wednesday, December 10, 2003 3:02 PM
To: [log in to unmask]
Subject: Re: [TN] BIG Boards...


Probably Northrup Grumman, Springfield, Missouri (formerly Litton ACD)
and Tyco, Stafford, CT.

At 02:16 PM 12/10/2003 -0500, you wrote:
>Hi again all!
>
>I know this question was asked before, but I didn't think I would ever
>need to know this, so that's why I didn't pay attention before.
>
>But does anybody know who can make a 26-layer, 16" X 45" fab, with
>ENIG, and dry film solder mask?
>
>Don't ask me what this goes into, I asked and was advised that if I was

>told, I would have to be killed...
>
>-Steve Gregory-
>
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