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December 2003

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Subject:
From:
Doug Pauls <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 9 Dec 2003 14:14:08 -0600
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Good afternoon all,

Internally, we are having discussions on the amount of allowable overhang
of passive SMT components (R and C).  Our specifications are based on
solder joint connections and the solder specifications are not in question.
We have an application where a silver filled adhesive is used to make the
connection between SMT metalization and mounting pad.  The solder joint
requirements were applied to these adhesive joints and I am wondering as to
the validity of this.  The adhesive is epoxy based and, in my mind, more
rigid than solder.  I think we are unnecessarily rejecting parts that are
acceptable.

So, before I go off and do a complex designed experiment, I thought I would
check with the Technet crowd first.  Do you know of any studies that show
the adhesive force (e.g. pull strength) vs. the degree of pad overhang?

Doug Pauls
Rockwell Collins

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