IPC is now accepting registrations for the 2nd International conference on Flexible Circuits, Chip Scale and Bare Die Packaging, January 7-8, 2004 at the Fiesta Inn in Tempe, AZ. For more information on how to register or to find out who is presenting at the conference, visit www.ipc.org/FlexNChips.
 
All the top flexible circuits and packaging suppliers and manufactures will showcase their products and services at this event. Don't miss out on your chance to network with your peers and possibly get new leads at the Networking Reception. REGISTER TODAY!
 
 

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