Hello,
Will you please explain why solder paste would be a more likely culprit for
voiding?
Thank you,
David Tremmel
>From: Mel Parrish <[log in to unmask]>
>Reply-To: "TechNet E-Mail Forum." <[log in to unmask]>, Mel
>Parrish <[log in to unmask]>
>To: [log in to unmask]
>Subject: Re: [TN] Old Array Devices
>Date: Tue, 9 Dec 2003 08:46:38 -0600
>
>Good morning Bev,
>I can recall some FA studies where oxidation of the ball was considered a
>contributor to voiding at the sphere interface and visual surface
>appearance
>of the ball after reflow. Albeit solder paste is a more likely culprit for
>voiding.
>Stay warm!
>
>Best regards,
>
>Mel Parrish
>Soldering Technology International Inc.
>Madison, AL
>
>-----Original Message-----
>From: TechNet [mailto:[log in to unmask]]On Behalf Of Bev Christian
>Sent: Monday, December 08, 2003 10:45 AM
>To: [log in to unmask]
>Subject: [TN] Old Array Devices
>
>
>Good morning,
>Have any of you ever seen an array device that did not solder because of
>oxidation of the eutectic solder balls on the device? To be clear, I am
>excluding organic contamination, insufficient reflow temperature
>conditions,
>poor paste, poor boards, misregistration, etc. - just considering
>oxidation.
>Thanks.
>
>Bev Christian
>Research in Motion
>
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