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December 2003

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Subject:
Re: Old Array Devices
From:
Mel Parrish <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 9 Dec 2003 08:46:38 -0600
Content-Type:
text/plain
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text/plain (54 lines) 
Good morning Bev,
I can recall some FA studies where oxidation of the ball was considered a
contributor to voiding at the sphere interface and visual surface appearance
of the ball after reflow. Albeit solder paste is a more likely culprit for
voiding.
Stay warm!

Best regards,

Mel Parrish
Soldering Technology International Inc.
Madison, AL

-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Bev Christian
Sent: Monday, December 08, 2003 10:45 AM
To: [log in to unmask]
Subject: [TN] Old Array Devices


Good morning,
Have any of you ever seen an array device that did not solder because of
oxidation of the eutectic solder balls on the device?  To be clear, I am
excluding organic contamination, insufficient reflow temperature conditions,
poor paste, poor boards, misregistration, etc. - just considering oxidation.
Thanks.

Bev Christian
Research in Motion

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