Dear Ken,

I am valuating a system which uses Cu2O particles mixed with any resin
including Epoxy, which allows a much better thermal dissipation from within
the resin.
It is a patented system which also allows simplified copper plating with or
without Electroless !!! which makes the peeling strength almost double usual
without compromising dielectric properties...

Best applications are within :

- Resin only such as for HDI layers where thermal properties and Cu
adherence are critical
- Most resins / Polyimides for FPC
- Component encapsulants
- Any laminates
- Solder Masks where thermal properties need to be enhanced
- Resin glues where thermal properties need to be enhanced
- .....

Best Regards
Roland

www.PCBspecialist.com
www.TechnoSphere.ch
Jaquet Roland
Consultant
14 ch de Vers
1228 Plan-Les-Ouates,
GENEVA
Switzerland
[log in to unmask]
tel: +41-22-880-0405
fax: +41-22-880-0409
mobile: +41-79-203-3723



----- Original Message -----
From: "Dieselberg, Ron" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Monday, December 08, 2003 1:18 PM
Subject: Re: [TN] Better thermally conductive Epoxy...


> Ken, you might want to check with your local Loctite dealer to see if he
can help you.
>
> Ron Dieselberg
> Trainer
> CMC Electronics Cincinnati
> [log in to unmask]
>
>
> -----Original Message-----
> From: Ken Patel [mailto:[log in to unmask]]
> Sent: Thursday, December 04, 2003 18:32 PM
> To: [log in to unmask]
> Subject: [TN] Better thermally conductive Epoxy...
>
>
> I am looking for an epoxy that gets cured quicker. The BGA on which we
will
> be mounting heat sink has a visible silicon die. Other area of the BGA has
> some caps. We are currently using 3 M's thermally conductive epoxy (TC
2810)
> but looking for something else that get cured at faster rate. TC2810 takes
> 24 hours to get cured. Can you guys recommend any better epoxy? Any help
> will be highly appreciated.
>
>
>
> Re,
>
> Ken Patel
>
>
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