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December 2003

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Subject:
From:
Ken Patel <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 4 Dec 2003 15:31:37 -0800
Content-Type:
text/plain
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text/plain (24 lines)
I am looking for an epoxy that gets cured quicker. The BGA on which we will
be mounting heat sink has a visible silicon die. Other area of the BGA has
some caps. We are currently using 3 M's thermally conductive epoxy (TC 2810)
but looking for something else that get cured at faster rate. TC2810 takes
24 hours to get cured. Can you guys recommend any better epoxy? Any help
will be highly appreciated.



Re,

Ken Patel


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