 
| Subject: | |
| From: | |
| Reply To: | TechNet E-Mail Forum. |
| Date: | Thu, 4 Dec 2003 07:51:23 +0100 |
| Content-Type: | text/plain |
| Parts/Attachments: |
|
|
Ken,
this one covers most, lots of references too.
You working with radar parts too?
Good Luck!
Ingemar Hernefjord
Ericsson Microwave Systems
http://www.jedec.org/download/search/JEP142.pdf
-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Bloomquist, Ken
Sent: den 3 december 2003 23:39
To: [log in to unmask]
Subject: [TN] Chips in Large MLCC's
We are trying to make a determination of potential long term damage caused
by small chips in large multilayer ceramic capacitors (MLCC). We're talking
about leaded, .60" X .120", stacked three high MLCC's. The obvious chips
that we are rejecting are at the edge with the top surface area of about .1"
X .05" X .01" deep.
IPC-A-610 talks a little bit about chips and cracks to small chip components
but does not really address these big guys. It has been our experience in
the past that any crack (chip) can propagate, particularly with moisture
present, into a rather exciting failure.
The thing we are having trouble with is defining what is an acceptable
appearance for these parts. The chip may not go down to the substrate but
we're still concerned about long term effects on the ceramic. If any of you
can point us to a document that might provide some guidance it sure would
appreciated.
Thanks,
Ken Bloomquist
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
-----------------------------------------------------
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
-----------------------------------------------------
|
|
|
