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December 2003

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Tue, 30 Dec 2003 13:55:51 -0500
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Hi Steve,

Thanks for the response.

Your response was the premise behind my question and as to why I presented
the question.

Most folks I talked to due measure the first board and then again at some
quantity or time after and as you put it is there a benefit to the
investment?

Lets see what we get!

Thanks
Dan mauro


Steve Gregory writes:

> Hi Tom!
>
> Yes, and those systems aren't that cheap either!
>
> Let me just throw this question out to everybody; let's assume that the
> stencil has been ordered correctly (correct thickness for the type and pitch of the
> components being placed), the printer has been set-up correctly (correct
> squeegee speed, pressure, and separation speed, along with proper board support),
> is there REALLY any value added, or will things vary THAT much when using
> METAL squeegee blades, that thickness measurements need to be done every 25 boards
> or whatever, during a run?
>
> I have my own opinion, and experiences about this...but I would like to hear
> what everybody else thinks.
>
> -Steve Gregory-
>
>> Use ASC212 for solder paste thickness and volume. Currently check the first
>> two boards at beginning of the run and every hour thereafter. Have
>> experience with CyberOptics LSMII and Sentry- running a gage R&R will reveal a lot
>> about the measuring system. Depending on the system the GR&R ranged from 5 to
>> 25% .
>>
>> Tom Gervascio
>> Senior Process Engineer
>> Sparton Electronics
>> (352) 540-4040
>>
>
>
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