Hi Tom!

Yes, and those systems aren't that cheap either!

Let me just throw this question out to everybody; let's assume that the
stencil has been ordered correctly (correct thickness for the type and pitch of the
components being placed), the printer has been set-up correctly (correct
squeegee speed, pressure, and separation speed, along with proper board support),
is there REALLY any value added, or will things vary THAT much when using
METAL squeegee blades, that thickness measurements need to be done every 25 boards
or whatever, during a run?

I have my own opinion, and experiences about this...but I would like to hear
what everybody else thinks.

-Steve Gregory-

> Use ASC212 for solder paste thickness and volume. Currently check the first
> two boards at beginning of the run and every hour thereafter. Have
> experience with CyberOptics LSMII and Sentry- running a gage R&R will reveal a lot
> about the measuring system. Depending on the system the GR&R ranged from 5 to
> 25% .
>
> Tom Gervascio
> Senior Process Engineer
> Sparton Electronics
> (352) 540-4040
>


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