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December 2003

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Subject:
From:
Brummer Chuck <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 19 Dec 2003 08:08:54 -0800
Content-Type:
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The 2 oz. copper will be roughly 2.8 mils.  But is it RA or ED?  ED, electro
deposited, tooth will bury into the coated polyimide, Kapton, film if
adhesiveless.  But if an adhesive based laminate is used then how much?
Another question, How did you get 1.5 mil photo coverlay to fill 2 ounce
copper, you should have a lot of trapped air.

Chuck Brummer
Siemens Medical Solutions

-----Original Message-----
From: Bissonnette, Jean-Francois [mailto:[log in to unmask]]
Sent: Friday, December 19, 2003 7:59 AM
To: [log in to unmask]
Subject: [TN] Flex circuit information needed


I would like to know how to calculate the thickness of a flex circuit
assembly.

Here are the informations I have

Base:  .002 thk polymide (kapto)
2 OZ Copper Clad Laminate, both sides
Coverplate:  .0015 flexible photoimageable coverlay (both sides)

It's obvious that I'll end up with 2x0.0015 + 2x0.002 for the first and last
Item, but
how can I get the thickness of the copper laminate?

Thanks!

Jean-François Bissonnette
Vérificateur, Contrôle de la Qualité
Électronique
Produits et Procédés
Vapor Rail Inc.
10655 Henri-Bourassa O.
St-Laurent, Qc
H4S 1A1

(514) 335-4200 x2021
(514) 335-4231 fax



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