Kat,

   I have this type of damage in some BGA.   However, this shared artifact
take the cake.   In PCB/PWB there is a 0.030 keep out zone from edhe of card
.   No too sure how that applies here.   The rough edge is a sure point for
MOISTURE INGRESS into the compromised laminate edge.   Very curious on what
ruling you receive for supporting document.   Let me guess that the supplier
is OVERSEAS.

Victor,

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Kathy Kuhlow
Sent: Thursday, December 18, 2003 3:49 PM
To: [log in to unmask]
Subject: [TN] Need your opinion


I need your opinion on the delamination on the edges of these BGA devices.
Steve was nice enough to post the photo's I have on his website.  The
pictures are numbered as: MVC1-MVC3. They can be found at:

http://www.stevezeva.homestead.com

Kat

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e To
unsubscribe, send a message to [log in to unmask] with following text in the
BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or
(re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet
NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send
e-mail to [log in to unmask]: SET Technet Digest Search the archives of
previous posts at: http://listserv.ipc.org/archives Please visit IPC web
site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700
ext.5315
-----------------------------------------------------

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
-----------------------------------------------------