TECHNET Archives

December 2003

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
John Parsons <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 3 Dec 2003 11:51:46 -0800
Content-Type:
text/plain
Parts/Attachments:
text/plain (23 lines)
Greetings all,

I have moved on from my old life in the fabrication business to learn some
new things in the contract manufacturing sector.  My first question to the
group in this new role is on the subject of touch-up as a standard process
step after smt placement and reflow.  Does everyone do this or can it be
eliminated by process control during placement and reflow?  I personally
don't much care for non-value added processes but was just wondering what
the general feeling out there was.

Regards
John Parsons

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
-----------------------------------------------------

ATOM RSS1 RSS2