Happy:
        Non glass materials explains it all.
        Thanks, Ramon

> -----Original Message-----
> From: TechNet [SMTP:[log in to unmask]] On Behalf Of Happy Holden
> Sent: Wednesday, December 17, 2003 10:49 AM
> To:   [log in to unmask]
> Subject:      Re: [TN] sequential build up process
>
> Hi Ramon,
> I don't know which pictorials you are looking at, but there is a number of
> ways to make microvias in non-glass reinforced dielectrics (like liquid
> dielectrics, RCC, polyimide film and Thermount) using plasma or chemicals
> (hot NaOH or KOH).  There is also photo-sensitive dielectrics.  When you
> consider that the microvias in flex-circuits for inkjet cartridges are all
> etched rather than laser drilled, there must be more etched microvias than
> laser drilled ones in the world.  The IPC Standards 2315 and 2226 show
> about  8 different ways of making small vias in dielectrics.  Glass is one
> of those materials that is very difficult to dissolve, hence a lot of
> dielectrics are not glass reinforced.
>
> Happy Holden
> Westwood Associates
>
>
>
>
>
> "Dehoyos, Ramon" <[log in to unmask]>
> 12/17/2003 09:55 AM
>
>
>         To:     "TechNet E-Mail Forum." <[log in to unmask]>, [log in to unmask]
>         cc:
>         Subject:        RE: [TN] sequential build up process
>
>
>                  Happy:
>                  The vias in the pictorials seemed to be etched instead of
> drilled.
> If that is the case, what kind of chemical etches glass and epoxy?
>                  Regards,
>                  Ramon
>
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