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December 2003

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From:
"d. terstegge" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 17 Dec 2003 17:42:36 +0100
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Hi Technet,

I'm having some problems with a tantalum capacitor that outgasses
during reflow soldering. The result is that components placed next to
this tantalum are just blown off their pads, plus 25% of the caps
themselves fail at testing.
After waiting several months for the vendor's reaction we finally
received a note mentioning that excessively humid storage conditions may
lead to problems, and in such cases baking of the parts is recommended.
Although I don't think we have excessive conditions here (R.H. normally
between 30 and 70%, occasionally up to 75 %) the vendor tries to make us
believe that we should put these parts and all similar tantalum caps in
our separate dry storage room (that we only use for parts that have a
JEDEC MSD level of 2 or higher).

My questions:  Should our internal handling procedures be based on
"vague" information that we get after a quality complaint, or may I
expect that our component supplier conforms to JEDEC standards for
packing and labelling of moitsure sensitive parts ?  Do you see it more
often, that component manufacturers (and this is a large one !!!) seem
completely unaware of the IPC/JEDEC specs for MSD's ?

Best regards,

Daan Terstegge
Thales Communications
Unclassified mail
Personal Website: http://www.smtinfo.net

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