Ron:
                It is off by more than 1%. The mix can be brought back to
the right percentage by adding more lead. Though  I would have it confirmed
by another lab before any adding of lead is made. As far as the end result
joint, the joint would not be eutectic. It would be a higher temperature
solder join, but not much higher. If it is shinny and smooth it should be
reliable. Have all the contaminant metals checked  as stated in J std 001-C
and in previous mails.
        My two cents, Ramon



> -----Original Message-----
> From: Dieselberg, Ron [SMTP:[log in to unmask]]
> Sent: Wednesday, December 03, 2003 10:21 AM
> To:   [log in to unmask]
> Subject:      Re: [TN] SnPb Solder pot composition.
>
> Yordan, What was your nominal SnPb? IPC J-001 indicates the alloy shall be
within +/- 1.5% of the solder specified. Since you are close to 63/37 you
should be OK if your contamination limits are under control.
> If you have a copy of J-001 see para. 5.3, 5.4 and table 5-1.
> Hope this helps.
>
> Ron Dieselberg
> Trainer
> CMC Electronics Cincinnati
> [log in to unmask]
>
>
> -----Original Message-----
> From: Yordan Venev [mailto:[log in to unmask]]
> Sent: Wednesday, December 03, 2003 7:58 AM
> To: [log in to unmask]
> Subject: [TN] SnPb Solder pot composition.
>
>
> We have made a composition analysis of our solder wave solder pot and
> discovered a deviation of the SnPB content. The Sn percentage had gone up
to
> 65.45% and the Pb content down to 34.54%. I suppose there will be a
(small)
> change in the constitutional behaviour of the alloy - some bigger range of
> the liquid-to-solid stage. Except this, what should we be aware of in
> practice in regards to solder joint quality and reliability? We continue
to
> maintain the pot temperature at 250 deg C (482 deg F).
>
> Any inputs will be appreciated!
>
> Best regards,
> Yordan Venev
>
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