Happy:
The vias in the pictorials seemed to be etched instead of drilled.
If that is the case, what kind of chemical etches glass and epoxy?
Regards,
Ramon
> -----Original Message-----
> From: TechNet [SMTP:[log in to unmask]] On Behalf Of Happy Holden
> Sent: Wednesday, December 17, 2003 8:36 AM
> To: [log in to unmask]
> Subject: Re: [TN] sequential build up process
>
> Dear Mr S.
> The sequential build up (SBU) process I assume you are asking about is the
> HDI-Microvia one, not the mech drilled blind-buried via SBU process,
> although both are the same process, the HDI just with smaller vias.
>
> Microvias have been around 20 years now. HP and IBM used them in products
> in the early 80's. Japanese took them up in the 90's for portable
> products, now they are the fastest growing segment of the PCB market. ALL
> cell phones are now SBU-microvia boards, as are ALL organic flip-chip
> packages like the Intel Celeron or Pentium 4. Most PDAs use microvia SBU,
> as do more and more high-performance multilayers for networking and
> telecom. But some HDI-Microvia boards are not SBU (the IPC Type I is not)
> because it is NOT sequentially laminated.
>
> There are many Web Sites with information and design rules about SBU and
> Microvias. My Web Site has 25 articles you can download as well as price
> and density comparisons between the two technologies. You are welcome to
> go to www.westwoodpcb.com
>
> Good Hunting
>
> Happy Holden
> Westwood Associates
>
>
>
>
>
> Murulidhara S <[log in to unmask]>
> Sent by: TechNet <[log in to unmask]>
> 12/17/2003 01:32 AM
> Please respond to "TechNet E-Mail Forum."; Please respond to Murulidhara S
>
>
> To: [log in to unmask]
> cc:
> Subject: [TN] sequential build up process
>
>
> Dear Technetters,
>
> I want to know about sequential build up process for MLB fabrication. Can
> any one brief about the sequential build up process. Also let me know
> related web sites regarding sequential build up process. Is this process
> proven and recommended?
>
> Regards,
> Mr.Murulidhara S.
> Deputy Chief Engineer ,
> PCB and Chemical Lab - R&D,
> ITI Ltd. ,
> Dooravani Nagar ,
> Bangalore
> INDIA
> PIN-560 016
>
> Ph : 91-080-8503959
> Fax : 91-080-5650971
>
>
>
> ---------------------------------------------------
> Technet Mail List provided as a service by IPC using LISTSERV 1.8e
> To unsubscribe, send a message to [log in to unmask] with following text in
> the BODY (NOT the subject field): SIGNOFF Technet
> To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
> To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
> Search the archives of previous posts at: http://listserv.ipc.org/archives
> Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16
for additional information, or contact Keach Sasamori at [log in to unmask] or
847-509-9700 ext.5315
> -----------------------------------------------------
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
-----------------------------------------------------
|
