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December 2003

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Subject:
From:
Victor Hernandez <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 17 Dec 2003 06:33:10 -0600
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Gunter,

   I do not recall this publication.   Can you share a URL address for
viewing.

Victor,

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Guenter Grossmann
Sent: Wednesday, December 17, 2003 2:51 AM
To: [log in to unmask]
Subject: [TN] Antw: Re: [TN] solder structure


Susan, Victor

We have pictures of 
- SnAg3.8Cu0.7
- SnAg3.5
- SnZn9
- SnBi57

Some of them are published in:
- No fear of Lead Free Solder, 21. ICEC 2002, Zurich. ISBN 3-9522504-0-6
- Results of Comparative Reliability Tests on Lead Free Solder, 52 ICTC San
Diego 2002, ISSN 0569- 5503

More publications are in preparation.

Best regards

Günter


EMPA
Swiss Federal Laboratories  for Materials Testing and Research Centre for
Reliability Guenter Grossmann,  Senior Engineer

8600 Duebendorf
Switzerland

Phone: xx41 1 823 4279
Fax :     xx41 1 823 4054
mail:     [log in to unmask]

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