Subject: | |
From: | |
Reply To: | TechNet E-Mail Forum. |
Date: | Wed, 17 Dec 2003 09:51:01 +0100 |
Content-Type: | text/plain |
Parts/Attachments: |
|
|
Susan, Victor
We have pictures of
- SnAg3.8Cu0.7
- SnAg3.5
- SnZn9
- SnBi57
Some of them are published in:
- No fear of Lead Free Solder, 21. ICEC 2002, Zurich. ISBN 3-9522504-0-6
- Results of Comparative Reliability Tests on Lead Free Solder, 52 ICTC San Diego 2002, ISSN 0569- 5503
More publications are in preparation.
Best regards
Günter
EMPA
Swiss Federal Laboratories for Materials Testing and Research
Centre for Reliability
Guenter Grossmann, Senior Engineer
8600 Duebendorf
Switzerland
Phone: xx41 1 823 4279
Fax : xx41 1 823 4054
mail: [log in to unmask]
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
-----------------------------------------------------
|
|
|