Hi Barry,

You forgot to mention the VERY IMPORTANT sentences just above these so
called "requirements":

"The following guidelines are provided as assesment criteria for the
attachment technology process. Without substantial documented
reliability data at the time of publication of this revision, no
acceptability criteria are provided".

Voids larger than 25% which occur as a result of a boarddesign with
via's in pads can be perfectly acceptable and may be just as reliable as
joints without voids !!

Daan Terstegge
Unclassified mail
Personal Website: http://www.smtinfo.net

>>> [log in to unmask] 12/16/03 06:21pm >>>
Ken,
IPC-A-610C Page 12-75 calls out:
Acceptable Class 1,2,3-  Less than 10% voiding in the Ball to Board
Interface.
Process Indicator Class 2,3-  10-25% voiding in the Ball to Board
Interface.
-voiding in the BGA solder ball to board interconnection up to 25%may
or may
not be a reliability issue and should be determined in your process
development.
-BGA solder joint reliability studies performed at some industry
locations
show that limited voiding in BGA balls does not impact long term
reliability.

Defect Class 1,2,3-  More than 25% voiding in the Ball to board
interface.


Barry


-----Original Message-----
From: Ken Patel [ mailto:[log in to unmask] <mailto:[log in to unmask]>
]
Sent: Tuesday, December 16, 2003 10:09 AM
To: [log in to unmask]
Subject: [TN] Rejection criteria for voids in BGA solder joints


All,

What are the current rejection criteria for voids in BGA solder joints?
I am
preparing assembly notes in this regards.



Any help will be highly appreciated.



Re,

Ken Patel


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