To All,
There is a patented process known as SIPAD developed by Siemens AG and is
available from licensed fabricators.  Although I have no experience using
boards fabricated with this process, the literature that I have perused
seems to offer some assembly advantages.  The process provides a solid
solder deposit that is subsequently flattened (or calendered) to a certain
thickness and texture, deposited  with a dry tacky flux then covered with a
sheet of protective paper. The assembly process supposedly consists of
removing the protective paper, placing the components and reflowing the CCA.
This may be a viable solution to consider.
Good Luck.

Steve Sauer
Mfg Engineer
Northrop Grumman, Xetron
Cincinnati, OH

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