Ken,
IPC-A-610C Page 12-75 calls out:
Acceptable Class 1,2,3-  Less than 10% voiding in the Ball to Board
Interface.
Process Indicator Class 2,3-  10-25% voiding in the Ball to Board Interface.
-voiding in the BGA solder ball to board interconnection up to 25%may or may
not be a reliability issue and should be determined in your process
development.
-BGA solder joint reliability studies performed at some industry locations
show that limited voiding in BGA balls does not impact long term
reliability.

Defect Class 1,2,3-  More than 25% voiding in the Ball to board interface.


Barry


-----Original Message-----
From: Ken Patel [ mailto:[log in to unmask] <mailto:[log in to unmask]> ]
Sent: Tuesday, December 16, 2003 10:09 AM
To: [log in to unmask]
Subject: [TN] Rejection criteria for voids in BGA solder joints


All,

What are the current rejection criteria for voids in BGA solder joints? I am
preparing assembly notes in this regards.



Any help will be highly appreciated.



Re,

Ken Patel


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