I may have the wrong spelling, but the process I am talking about is
running the boards through a small machine where the top roller is set to
a precise distance and it will flatten the solder bumps to that height.
It's like coining only that not the right term.  They called it
cullendering, although that's an alternate spelling for colander, the bowl
shaped strainer.  Maybe somebody with metalworking background can give me
the correct term.

Happy Holden
Westwood Associates





Ellsworth Berkowitz <[log in to unmask]>
Sent by: TechNet <[log in to unmask]>
12/16/2003 09:45 AM
Please respond to "TechNet E-Mail Forum."; Please respond to Ellsworth
Berkowitz


        To:     [log in to unmask]
        cc:
        Subject:        Re: [TN] .5 mm pitch components


I volunteer to ask the "dumb" question.

Mr. Holden, could you please define the term "cullender" as used in your
email?  I am unfamiliar with this term in regards to pc board processing.

However, when it comes to pasta, I can wield a mean colander.

Thank you.

Ellsworth D. Berkowitz, P.E.
Paradyne Networks LLC
www.paradyne.com

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