Yordan, I'll leave others to comment on solder joint quality and
reliability.  How are the composition analyses done?  I'd bet the
measurements are not truly good to 0.01%.  I asked a big solder manufacturer
for measurement quality data 2 or 3 years ago, and did not get a good
answer.  Lou Hart

-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Yordan Venev
Sent: Wednesday, December 03, 2003 7:58 AM
To: [log in to unmask]
Subject: [TN] SnPb Solder pot composition.


We have made a composition analysis of our solder wave solder pot and
discovered a deviation of the SnPB content. The Sn percentage had gone up to
65.45% and the Pb content down to 34.54%. I suppose there will be a (small)
change in the constitutional behaviour of the alloy - some bigger range of
the liquid-to-solid stage. Except this, what should we be aware of in
practice in regards to solder joint quality and reliability? We continue to
maintain the pot temperature at 250 deg C (482 deg F).

Any inputs will be appreciated!

Best regards,
Yordan Venev

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