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December 2003

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Mon, 15 Dec 2003 09:56:46 EST
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This is one excellent reason that we allow NO separation in microsection
evaluations before or after Thermal Stress testing on the Lot conformance testing
prior to shipping you the boards to assemble.

If you had a test set and could actually operate the assemblies until they
"get hot" or experience a temperature rise, you might be able to pick up the
intermittencies.  These will then go away as the board cools down until you
finally exercise the inner layer connection to the point there is a hard open.

Susan Mansilla
Robisan Lab

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