Keeping it out of where you don't want it (like connectors and contacts) can
be challenging. There is also some learning curve associated with masking
removal. Slow, expensive process that does provide superior results.
Good Luck,
Bruce Misner
-----Original Message-----
From: Reuven ROKAH [mailto:[log in to unmask]]
Sent: Sunday, December 14, 2003 2:54 AM
To: [log in to unmask]
Subject: [TN] Conformal coating - PARYLENE DIMER DPX-C
Hi Perylene users,
Can you share with your experience and inform the + and - of this process?
I have last week visited one of the users site and it seems promising.
I have long experience with spraying systems and not vacuum systems.
Best Regards
Reuven
Graham Naisbitt
<Graham.Naisbitt@CON To: [log in to unmask]
COAT.CO.UK> cc:
Sent by: TechNet Subject: Re: [TN] Foreign
material on top of the conformal coating
<[log in to unmask]>
12/12/2003 18:02
Please respond to
"TechNet E-Mail
Forum."; Please
respond to Graham
Naisbitt
Bruce
If you are applying epoxies and other materials after conformal coating,
just be sure that the solvents (if any) are not affecting the coating
during
their application and curing.
Otherwise this should simply be regarded as a cosmetic issue.
Cleaning after all these processes is unlikely to be a good option, as the
coating will now be expected to withstand your cleaning process...and
surface cleaning using brushes, swabs etc., are only likely to be moving
the
stuff around on the surface rather than removing it.
Hope this helps
--
Regards Graham Naisbitt
[log in to unmask]
Cell: 079 6858 2121
Office: +44 (0)1252 813706
Concoat Limited - Engineering Reliability in Electronics
NEW - HumiSeal 1H2O Bov Aerosol - NEW
Web: www.concoat.co.uk and www.concoatsystems.com
> Hey guys,
> I have be hit recently on a couple of occasions by the quality folks
> over "foreign material" that is present on CCA's after conformal coating.
> On quite a few boards we install heat sinks after CC and usually use an
> epoxy to aid in heat transfer as well as loctite on the mounting screws.
I
> have been gigged for the residuals (just smears really) whether it is on
> the solder pads or not. I know that we all are concerned with material
> left over directly on the solder connections, but I am having trouble
with
> this one from a logical standpoint. I mean lets face it, you definitely
> can't test for the presence of ionic contaminants or anything, but I know
> the general impression is the boards should be clean.
>
> I know the simple answer here is to clean up all the residuals (and
> everyone is instructed to do that), but there are times when stuff just
> happens.
>
> Your thoughts
>
> Bruce Stilmack
> GDLS-TO Manufacturing Engineer
> (850) 574-4773
> [log in to unmask]
>
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