Technet Members,
     We have identified a field return trend in a line of circuit boards.  The problem is occurs which a trace separates from the plated through hole
causing an open circuit.  Unfortunatly, we had to destructively analyze two boards to reach this solution.  The failure analysis points to a
manufacturing defect that will potentially affect an entire lot of boards.  We are looking for a non-destructive way to analyze this lot of boards to
determine whether or not a particular board suffers from a partially or intermittant open condition, on its way to becoming a hard open.  Any
recommendations would be greatly appreciated.  Thanks in advance...

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
-----------------------------------------------------