Are there any guidelines for solder volumes for BGAs?  If not what are
typical volumes people are using for 1.27mm, 1.0mm and below 1.0mm BGAs?
Are people printing 1:1 or overprinting to achieve specific volumes?

We are currently experiencing some problems with opens and intermittents
with many of our BGAs.  My feeling is that the problem is due to
insufficient solder volume, mostly because of some past experience with the
IBM global technology specification for BGA assembly which outlined some
very specific volume specifications.  Unfortunately the specification is
very expensive and buying it is not an option for me at this point.

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Gregory Parke
Senior Manufacturing Engineer
Coriolis Networks
330 Codman Hill Road
Boxborough, MA 01719
Voice:  978-264-1904 x651
Fax:    978-264-1909
[log in to unmask]
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