Fellow Technetters,



I need some recommendations on how to clean wire bondable gold pads before
bonding. We are electroplating 35-40 microinches of soft gold over 130
microinches of nickel. After gold plating we have to go through 2 press
cycles at 350 F for approx. 1.5 hours each to attach stiffeners onto the
flex. We then surface mount components and reflow. After all these heat
cycles we see some oxidation on the gold pads. What is a recommended
cleaning process to have a "fresh" surface to wire bond to. Thanks for the
help.



Regards Steve Kelly



PFC Flexible Circuits Limited

Ph: (416) 750-8433

Fax: (416) 750-0016

Cell: (416) 577-8433

E-Mail: [log in to unmask]




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