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Reply To: | TechNet E-Mail Forum. |
Date: | Tue, 16 Dec 2003 13:27:40 -0500 |
Content-Type: | text/plain |
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To All,
There is a patented process known as SIPAD developed by Siemens AG and is
available from licensed fabricators. Although I have no experience using
boards fabricated with this process, the literature that I have perused
seems to offer some assembly advantages. The process provides a solid
solder deposit that is subsequently flattened (or calendered) to a certain
thickness and texture, deposited with a dry tacky flux then covered with a
sheet of protective paper. The assembly process supposedly consists of
removing the protective paper, placing the components and reflowing the CCA.
This may be a viable solution to consider.
Good Luck.
Steve Sauer
Mfg Engineer
Northrop Grumman, Xetron
Cincinnati, OH
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