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Tue, 16 Dec 2003 09:41:25 -0800 |
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Check out IPC-7095, 7.4 Assembly accept/reject criteria.
joe
-----Original Message-----
From: Ken Patel [mailto:[log in to unmask]]
Sent: Tuesday, December 16, 2003 9:09 AM
To: [log in to unmask]
Subject: [TN] Rejection criteria for voids in BGA solder joints
All,
What are the current rejection criteria for voids in BGA solder joints? I am
preparing assembly notes in this regards.
Any help will be highly appreciated.
Re,
Ken Patel
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Technet Mail List provided as a service by IPC using LISTSERV 1.8e
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Search the archives of previous posts at: http://listserv.ipc.org/archives
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