Thanks everyone for your input.
-----Original Message-----
From: Dehoyos, Ramon [mailto:[log in to unmask]]
Sent: Saturday, 1 November 2003 12:49 AM
To: [log in to unmask]
Subject: Re: [TN] Pb Free PB Asy
Per-Erik:
Excellent article, Thanks for sharing it. Mixing of components and
solders seems to impact BGAs the most due to the concentration of the lead
at the base of the solder joints. In the case of a ball solder joint of
BGAs, it would be catastrophic. Specially if the board is exposed to
vibration such as in the airline or auto ndustry for comercial and missile
or air defense for the military.
Regards,
Ramon
> -----Original Message-----
> From: Tegehall Per-Erik [SMTP:[log in to unmask]]
> Sent: Friday, October 31, 2003 3:59 AM
> To: [log in to unmask]
> Subject: Re: [TN] Pb Free PB Asy
>
> The document can be found on
> http://www.aimsolder.com/techarticles/Lead%20Contamination%20in%20Lead-Fre
> e%20Electronics%20Assembly.pdf
>
> Per-Erik Tegehall
> IVF, Sweden
>
> -----Ursprungligt meddelande-----
> Från: Mark Austin [mailto:[log in to unmask]]
> Skickat: den 31 oktober 2003 09:21
> Till: [log in to unmask]
> Ämne: Re: [TN] Pb Free PB Asy
>
>
> I have read a document produced by AIM which gives evidence of possible
> reliability problems when soldering Leaded BGA's with Lead Free paste. I
> would guess the reverse is true if you have a lead free BGA and lead paste
> and you take the profile over the lead free reflow temperature. Apparently
> the extra lead migrates through the joint and collects at the last point
> to
> cool resulting in a weak joint. You should be able to find the document on
> the AIM site, if not mail me off-line and I will forward you the document.
>
> Mark Austin
> Process Engineer
> ACW Technology Ltd
> UK
> [log in to unmask]
>
> ===== Original Message from [log in to unmask] (TechNet E-Mail Forum.) at
> 30/10/03 23:09
> >hi all
> >
> >Just a question to all the BGA experts out there ;)
> >
> >How would you tackle BGA assembly where there are both Pb Free BGAs and
> the
> >standard Sn/Pb BGAs on the same board?
> >Our paste manufacture recommended we maximise the peak as far as possible
> >but my concern is how would this affect the other BGAs (not Pb Free) on
> the
> >board. Would this degrade the joint due to excess heat and possibly
> longer
> >time above Eutectic for other components? What would be a good compromise
> >peak temperature to obtain a reliable joint?
> >
> >Has anyone done something like this that could share their experience.
> >Thank you in advance
> >
> >
> >kind Rgds
> >Dennis
> >
> >
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