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November 2003

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Subject:
Voids in BGAs solder joints
From:
Reuven ROKAH <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 4 Nov 2003 07:45:22 +0200
Content-Type:
text/plain
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text/plain (23 lines) 
Hello Jack and colleagues,
Do the % limitation of voids in BGAs solder joints, the IPC-A-610 is based
on research or experience?
I have with Motorola BGAs more voids that other BGAs suppliers and their
experts not accepting the IPC limitation and up to certain level, its
preferred by them.

If yes, ca I have the research article?

Best  Regards

ROKAH Reuven

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