Dear Technetters,

The company I work for is developing a relationship with a customer who
wants to reclaim BGAs without any baking.  During a recent visit to their
facility, they were demo-ing an Air-Vac to remove the BGAs.  I expressed to
them that using an Air-Vac or other automated system compared to a solder
pot (which they were initially using) is better because there is less
thermal shock to the component because and you can control the environment
the chip is exposed to.

These are desktop motherboards, so they have been in unknown environments.
With few exceptions, they are not interested in the condition of the board
after part removal so I recommended setting up their profiles with as much
bottom heat as possible and as little top heat as possible.

Will a 5 minute or more profile be able to out-gas enough moisture component
to significantly reduce the number of heat damaged components?

They are removing PBGAs, Ceramic BGAs, FCBGAs, and Cavity Down BGAs.  Are
any of these more susceptible to popcorning or thermal damage?

Thank you in advance for your help everyone.

_________________________________________________________________
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