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November 2003

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Subject:
From:
"Dehoyos, Ramon" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 6 Nov 2003 07:53:07 -0800
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        Excellent info:


> This topic has particular significance as component manufacturers go out
> of business, have products go DMS, change to out-of-country manufacturing
> facilities, or just change their internal processes and materials for what
> appears to be an existing/standard part.  We had a component that upon
> qualification was failing and was found to have pure tin coating and the
> manufacturer would not change his process.  The bottom line is, if you
> care, make no assumptions about the construction of your components, if
> not explicit in the specifications, and in the case of COTS parts beware
> of manufacturer's process/material changes.
>
It has been pointed out that although the article does not emphasize the
issue, there may be reasons that one would want to stay with Tin-Lead
coatings over lead-free coatings such as the melting properties.  This would
enter into the discussion even if a coating or other process could be used
to mitigate whisker growth.  More in-depth information is available from
other sources such as the NASA web site.
> http://nepp.nasa.gov/whisker/
>
> There are also interesting articles on the CALCE site:
> http://www.calce.umd.edu/lead-free/tin-whiskers/TINWHISKERMITIGATION.pdf
> http://www.calce.umd.edu/lead-free/tin-whiskers/TINWHISKERRISKS.pdf
>
>

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