Subject: | |
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Reply To: | TechNet E-Mail Forum. |
Date: | Wed, 5 Nov 2003 10:02:39 -0500 |
Content-Type: | text/plain |
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Madhu,
Have you checked your artwork(films) with a
densitometer. Your d-min, d-max may be off
which would mean you have a photoplotting/
film developing problem.
----- Original Message -----
From: "S.R. Madhuchandra" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Wednesday, November 05, 2003 7:19 AM
Subject: Re: [TN] Scum ring or Ring Mask on pad
> Dear Franklin,
>
> Please find the answers for your comments
>
> 1 - Tack drying is as per the specification provided by the Lacquer
> supplier.
> In order to check for over curing, we cured panelsfor more time
than
> specified and washed off the mask with out exposing. The developability of
> the mask was good and no solder mask residue was seen on the
> pads ( With this could we suspect the Exposing process to create the
> problem?)
>
> 2 - Checked the vacuum and found to be with in the specification.
> I feel if the vacuum problem is there, the outer part of the ring
> must have the mask on pad and not the inner ring. Your coments on this?
>
> 3 - Developing - The developer temp has been increased to 35 deg C
> Chemistry has been changed
> Dwell time and pressuer is maintained as per specification.
>
> Madhu
>
>
>
> |---------+----------------------------->
> | | Franklin D Asbell |
> | | <fasbell@NETWORKCI|
> | | RCUITS.COM> |
> | | Sent by: TechNet |
> | | <[log in to unmask]> |
> | | |
> | | |
> | | 10/29/2003 08:03 |
> | | PM |
> | | Please respond to |
> | | "TechNet E-Mail |
> | | Forum."; Please |
> | | respond to |
> | | Franklin D Asbell |
> | | |
> |---------+----------------------------->
>
>---------------------------------------------------------------------------
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> |
|
> | To: [log in to unmask]
|
> | cc: (bcc: S.R. Madhuchandra/NAN/ATS/IN)
|
> | Subject: Re: [TN] Scum ring or Ring Mask on pad
|
>
>---------------------------------------------------------------------------
---------------------------------------------------|
>
>
>
>
> What do you mean by excessive drying? do you mean final cure? By the time
> the panel gets to dry (either post-develop drying, or final cure) there
> should not be any mask there at all...if you're talking drying after
copper
> plate (leaving moisture or residuals) then again, this would cause
adhesion
> issues...your comments are puzzling...
>
> Franklin
>
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