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November 2003

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Subject:
From:
Tony Steinke <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 5 Nov 2003 10:02:39 -0500
Content-Type:
text/plain
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text/plain (126 lines)
Madhu,

Have you checked your artwork(films) with a
densitometer. Your d-min, d-max may be off
which would mean you have a photoplotting/
film developing problem.

----- Original Message -----
From: "S.R. Madhuchandra" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Wednesday, November 05, 2003 7:19 AM
Subject: Re: [TN] Scum ring or Ring Mask on pad


> Dear Franklin,
>
> Please find the answers for your comments
>
> 1 - Tack drying is as per the specification provided by the Lacquer
> supplier.
>        In order to check for over curing, we cured panelsfor more time
than
> specified and washed off the mask with out exposing. The developability of
> the mask              was good and no solder mask residue was seen on the
> pads ( With this could we suspect the Exposing process to create the
> problem?)
>
> 2 -  Checked the vacuum and found to be with in the specification.
>        I feel if the vacuum problem is there, the outer part of the ring
> must have the mask on pad and not the inner ring. Your coments on this?
>
> 3 - Developing - The developer temp has been increased to 35 deg C
>                                  Chemistry has been changed
>             Dwell time and pressuer is maintained as per specification.
>
> Madhu
>
>
>
> |---------+----------------------------->
> |         |           Franklin D Asbell |
> |         |           <fasbell@NETWORKCI|
> |         |           RCUITS.COM>       |
> |         |           Sent by: TechNet  |
> |         |           <[log in to unmask]> |
> |         |                             |
> |         |                             |
> |         |           10/29/2003 08:03  |
> |         |           PM                |
> |         |           Please respond to |
> |         |           "TechNet E-Mail   |
> |         |           Forum."; Please   |
> |         |           respond to        |
> |         |           Franklin D Asbell |
> |         |                             |
> |---------+----------------------------->
>
>---------------------------------------------------------------------------
---------------------------------------------------|
>   |
|
>   |       To:       [log in to unmask]
|
>   |       cc:       (bcc: S.R. Madhuchandra/NAN/ATS/IN)
|
>   |       Subject:  Re: [TN] Scum ring or Ring Mask on pad
|
>
>---------------------------------------------------------------------------
---------------------------------------------------|
>
>
>
>
> What do you mean by excessive drying? do you mean final cure? By the time
> the panel gets to dry (either post-develop drying, or final cure) there
> should not be any mask there at all...if you're talking drying after
copper
> plate (leaving moisture or residuals) then again, this would cause
adhesion
> issues...your comments are puzzling...
>
> Franklin
>
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