>       Hello all,
>       As we are starting the development of a long-term cost sensitive
> project. The product will be characterized by thick PCB (2.7 to 3.3 mm),
> aspect ration 10:1 and data rate of over 3 GB.
>       I have to place in the design guidelines requirements for the lead
> free technology.
>
>       Can you please advise:
>       1.      Which laminates will survive dual-reflow + 2 repair thermal
> cycle? We are looking for the cheapest possible materials, preferably
> based on glass-epoxy.
>       2.      Are the compliant laminate already in stable production? If
> not - when?
>       3.      Do these laminates have the same electrical characteristics
> (breakdown voltage, electrical losses, Dk) as the FR4?
>       4.      Do the new pastes have different specifications from the
> stencil? pads design?
>
>       Regards
>       Ofer Cohen
>       Manager - Quality Assurance, Reliability and Production Technologies
>       Seabridge LTD
>
>

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