Tough crowd!
Mike McMaster
RF Product Engineer
Merix Corporation
503-992-4263



> ----------
> From:         Jack C. Olson[SMTP:[log in to unmask]]
> Reply To:     TechNet E-Mail Forum.;Jack C. Olson
> Sent:         Wednesday, November 26, 2003 7:45 AM
> To:   [log in to unmask]
> Subject:      Re: [TN] Last Chance to Submit an Abstract for Flex & Chips
>
> Having "one of those days" Joe?
>
> Below is my humble editing:
>
> Don't use limits and limited in the same sentence.
>
> how 'bout this:
>
> "The performance of semiconductor technology is limited by the technology
> used for its interconnection."
>
> "will be" is wimpy.
>
> "New approaches to system design and interconnection ARE required, to
> overcome those barriers."
>
> instead of methods that WILL enable (in the next sentence), use methods
> that enable
>
> best wishes,
> (just screwing around since I don't feel like working today)
>
> Jack
>
>
>
> ----- Message from Joe Fjelstad <[log in to unmask]> on Tue, 25 Nov 2003
> 20:18:08 EST -----
>
>  Subject: Re: Last Chance to Submit an Abstract for Flex &
>           Chips
>
>
> Hi Alex,
>
> Below is my humble paper offering. How is the program shaping up?
>
> Cheers!
> Joe
>
>
> Novel Interconnection Technology for High Speed Chip to Chip Signal
> Transmission
>
> Joseph Fjelstad
> SiliconPipe, Inc.
>
>
> Abstract
>
> The performance limits of semiconductor technology, is increasingly being
> limited by the technologies used for its interconnection. In order to
> break
> through those barriers, new approaches to system design and
> interconnection
> will be
> required. This paper will describe novel, proprietary methods for making
> high
> speed flexible circuit based interconnections from chip to chip that will
> enable the performance of interconnections to keep pace with and even
> surpass the
> performance capabilities of semiconductor devices.
>
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