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November 2003

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Subject:
From:
"Sauer, Steven T." <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 26 Nov 2003 11:17:58 -0500
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Hi again Daan,
Let's try this from another angle, Common Sense 101.  I would look at the
requirement in 6.1.1 that specifies that the component shall meet the part
specification AND the intent behind the requirement in 9.2.6.8 Note 4 (that
discusses the solder touching the pkg or seal).  The intent of the
requirement is to focus on what an excessive amount of solder does to the
stress relief of the lead bend NOT that solder has wetted past the upper
bend to the lead/body interface.
Another hearty Good Luck.

Steve
-----Original Message-----
From: d. terstegge [mailto:[log in to unmask]]
Sent: Wednesday, November 26, 2003 10:29 AM
To: [log in to unmask]; [log in to unmask]
Subject: RE: [TN] Pretinning height on fine-pitch gull wing leads


Hi Steve,

I forgot to tell that my problem is that our QA rejects parts because
the solder has wicked to far onto the leads during pretinning. It's
treated like a solder fillet that touches the body, which to my opinion
makes no sense.
It's not a problem with gold embrittlement.

Daan Terstegge
Thales Communications
Unclassified mail
Personal Website: http://www.smtinfo.net

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