Hi Daan,
I'll go back to the old testament (MIL-STD-2000 para 5.4.17.2 on p. 114)
that states "...Only the portion of the lead subsequently to be soldered
need be..."
Similarly, J-STD-001 para 5.4.1 states that gold shall be removed from at
least 95% of the to-be-soldered surface.

The elimination of gold removal prior to soldering can be  done with
objective evidence that solder embrittlement is not compromised.  Depending
on your customer and quantifying how much gold is in the final solder
connection are the bumps on that road.  Good luck.

Steve Sauer
NG Xetron
Cincinnati, OH

-----Original Message-----
From: d. terstegge
Subject: [TN] Pretinning height on fine-pitch gull wing leads


Hi Technet,

We're using some ceramic QFP's here with gold-plated leads that need to
be pretinned prior to assembly.
Does anyone know a specification that prescribes how far the pretinning
solder coverage for these parts may be for boards that have to meet
ANSI-J-STD-001C class 3 requirements ?

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