Greetings,

I am seeking information regarding the design of Power/Ground layers within
the IPC-2221 Rev A coupon.  Specifically, when the accompanying PCB uses
direct connections to the copper planes (no thermals) should the coupon (A/B
section) represent this or should it have a thermal pad constructed from
features of the associated pad stack on other layers that have pads?  How
should connections to the surrounding plane be represented?  Should the
connections be staggered so that every other pad stack is a ground
connection or should specific pad stacks be used?  Or is a ground connection
not required?
If the answers to these questions are documented someplace, could someone
tell me where I might find the documents?  I do not see this information in
the IPC-2221 Rev A spec.  There is a paragraph in section 12.4.1 that
addresses non-functional lands, but there is no mention of power/ground
connections.  Figure 12-4 depicts a power/ground layer with no ground
connections but I don't see any text indicating there should not be
connections.
Any information would be greatly appreciated.
Best Regards,
Robert Zielfelder
Tooling Systems Engineer
Tyco Electronics
Printed Circuit Group - Stafford Division

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