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Subject:	Re: RE : [TN] Not that our process is out of control or anything, but --
From:	Werner Engelmaier <[log in to unmask]>
Reply To:	TechNet E-Mail Forum.
Date:	Tue, 18 Nov 2003 17:20:04 EST
Content-Type:	text/plain
Parts/Attachments:	text/plain (24 lines)

Hi Eric,
The preheating of the whole assembly:
(1) prevents thermal shock, which can cause warping due to large internal
temperature gradients,
(2) prevents large temperature differences between various parts of the
assembly, which also can cause warping (bi-metal strip effect),
(3) reduces the time the assembly needs to be exposed to the solder wave in
order to get good PTH fill,
(4) flux needs to activate and start its work prior to reaching the wave, and
more.

Regards,
Werner Engelmaier

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