With "gold bumps" you probably can expect a good contact and decent current
carrying capability, as long as the bumps are co-planar over the length of
the connector and you apply enough pressure. With the "fuzz buttons" it
probably is almost as good for current and more forgiving on the
co-planarity side. And for an easy solution you should also look into "Zebra
connectors" where you still need decent pressure but you probably will
encounter more resistance.
Regards,
Ahne Oosterhof
503-641-9428
[log in to unmask]
-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Crepeau, Phil
Sent: Tuesday, November 18, 2003 08:45
To: [log in to unmask]
Subject: Re: [TN] Gold 'bumps' on pads? How is it done?
hi,
i am reaching a little here, but... it may be that these gold bumps mate
with gold bumps on its mating board. compressive forces (applied by
fasteners?) maintain the connection.
some time back, an engineer at trw developed what turned out to be 'fuzz
buttons'. these were fine gold plated wires that were compressed into
'fuzz' in a cylinder. they had some spring action to them. they were used
to interconnect die and components on to test fixtures. the parts were
pressed onto the test fixture that had the buttons built into the test
adapters. the parts were then pushed onto the buttons for the interconnect.
after testing the part was removed and replaced with another one.
phil
-----Original Message-----
From: Brooks,Bill [mailto:[log in to unmask]]
Sent: Monday, November 17, 2003 1:32 PM
To: [log in to unmask]
Subject: [TN] Gold 'bumps' on pads? How is it done?
Hi,
I am looking at a sample board done with 'gold bumps' in the centers of the
pads to allow surface to surface mounting of 2 boards. Anyone have a 'clue'
how this is done? How it gets used?
I have not seen this before and would like to learn about it.
Bill Brooks
PCB Design Engineer , C.I.D., C.I.I.
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