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| From: | |
| Reply To: | TechNet E-Mail Forum. |
| Date: | Wed, 5 Nov 2003 17:49:26 +0530 |
| Content-Type: | text/plain |
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Dear Franklin,
Please find the answers for your comments
1 - Tack drying is as per the specification provided by the Lacquer
supplier.
In order to check for over curing, we cured panelsfor more time than
specified and washed off the mask with out exposing. The developability of
the mask was good and no solder mask residue was seen on the
pads ( With this could we suspect the Exposing process to create the
problem?)
2 - Checked the vacuum and found to be with in the specification.
I feel if the vacuum problem is there, the outer part of the ring
must have the mask on pad and not the inner ring. Your coments on this?
3 - Developing - The developer temp has been increased to 35 deg C
Chemistry has been changed
Dwell time and pressuer is maintained as per specification.
Madhu
|---------+----------------------------->
| | Franklin D Asbell |
| | <fasbell@NETWORKCI|
| | RCUITS.COM> |
| | Sent by: TechNet |
| | <[log in to unmask]> |
| | |
| | |
| | 10/29/2003 08:03 |
| | PM |
| | Please respond to |
| | "TechNet E-Mail |
| | Forum."; Please |
| | respond to |
| | Franklin D Asbell |
| | |
|---------+----------------------------->
>------------------------------------------------------------------------------------------------------------------------------|
| |
| To: [log in to unmask] |
| cc: (bcc: S.R. Madhuchandra/NAN/ATS/IN) |
| Subject: Re: [TN] Scum ring or Ring Mask on pad |
>------------------------------------------------------------------------------------------------------------------------------|
What do you mean by excessive drying? do you mean final cure? By the time
the panel gets to dry (either post-develop drying, or final cure) there
should not be any mask there at all...if you're talking drying after copper
plate (leaving moisture or residuals) then again, this would cause adhesion
issues...your comments are puzzling...
Franklin
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