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November 2003

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Subject:
From:
Ofer Cohen <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 18 Nov 2003 09:03:37 +0200
Content-Type:
text/plain
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text/plain (58 lines)
Jim,
We are avoiding the placement of via holes under "bicycles" - two pins
components. This is because the tolerances of the metal depth, the coating
and the plugging or tenting causes solderability problems to the components.

Regards
Ofer Cohen
Manager
Quality Assurance, Reliability and Production Technologies
Seabridge Ltd. - A Siemens Company

-----Original Message-----
From: Marsico, James [mailto:[log in to unmask]]
Sent: Monday, November 17, 2003 22:41
To: [log in to unmask]
Subject: [TN] tented over vias


Hello, Technet...
A quick question (or two, maybe three)...  We're designing a small
double-sided SMT PWB which is somewhat dense.  The designer has to place
plated through vias under some of the small chip components.  Our only
option is to tent over these vias with solder mask.  My question is what's
the best S.M. for this application and what's the max size hole it can be
used on.  Is it best to tent over both sides of the via or just one?
Thanks for your help,

Jim Marsico
Senior Engineer
Production Engineering
EDO Electronics Systems Group
[log in to unmask] <mailto:[log in to unmask]>
631-595-5879

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