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Subject:	Re: Gold 'bumps' on pads? How is it done?
From:	Tony Steinke <[log in to unmask]>
Reply To:	TechNet E-Mail Forum.
Date:	Mon, 17 Nov 2003 17:15:40 -0500
Content-Type:	text/plain
Parts/Attachments:	text/plain (45 lines)

Bill,
You can get the same effect by using dry film soldermask(4 mil). We call it
a pillar soldermask
----- Original Message -----
From: "Brooks,Bill" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Monday, November 17, 2003 4:32 PM
Subject: [TN] Gold 'bumps' on pads? How is it done?


> Hi,
> I am looking at a sample board done with 'gold bumps' in the centers of
the
> pads to allow surface to surface mounting of 2 boards. Anyone have a
'clue'
> how this is done? How it gets used?
> I have not seen this before and would like to learn about it.
>
> Bill Brooks
> PCB Design Engineer , C.I.D., C.I.I.
>
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