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| From: | |
| Reply To: | TechNet E-Mail Forum. |
| Date: | Mon, 17 Nov 2003 13:54:29 -0800 |
| Content-Type: | text/plain |
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Hi Bill, You could achieve this by adding a note to your Assy dwg.
i.e.
WAFFLE PATTERN BACK SIDE;
PLATE UP PATTERN OF .025 SQUARE COPPER PADS,
SPACED .050 APART, .0010 TO .0020 HIGH ON ENTIRE
BACKSIDE PER GERBER FILE XXX.WAF.
The raised pads allows surface area for adhesive or conductive solder. This way, during press, everything is not squeezed out.
HTH
Thomas Bauer
Sr. PCB Designer
Powerwave Technologies
916-941-3122
-----Original Message-----
From: Brooks,Bill [mailto:[log in to unmask]]
Sent: Monday, November 17, 2003 1:32 PM
To: [log in to unmask]
Subject: [TN] Gold 'bumps' on pads? How is it done?
Hi,
I am looking at a sample board done with 'gold bumps' in the centers of the
pads to allow surface to surface mounting of 2 boards. Anyone have a 'clue'
how this is done? How it gets used?
I have not seen this before and would like to learn about it.
Bill Brooks
PCB Design Engineer , C.I.D., C.I.I.
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